STM32F412VGT6 MCU STM32 Dynamic Efficiency MCU BAM High Performance and DSP FPU
♠ Product Description
| Product Attribute | Attribute Value |
| Manufacturer: | STMicroelectronics |
| Product Category: | ARM Microcontrollers - MCU |
| RoHS: | Details |
| Series: | STM32F412VG |
| Mounting Style: | SMD/SMT |
| Package / Case: | LQFP-100 |
| Core: | ARM Cortex M4 |
| Program Memory Size: | 1 MB |
| Data Bus Width: | 32 bit |
| ADC Resolution: | 12 bit |
| Maximum Clock Frequency: | 100 MHz |
| Number of I/Os: | 81 I/O |
| Data RAM Size: | 256 kB |
| Supply Voltage - Min: | 1.7 V |
| Supply Voltage - Max: | 3.6 V |
| Minimum Operating Temperature: | - 40 C |
| Maximum Operating Temperature: | + 85 C |
| Packaging: | Tray |
| Brand: | STMicroelectronics |
| Moisture Sensitive: | Yes |
| Product Type: | ARM Microcontrollers - MCU |
| Factory Pack Quantity: | 540 |
| Subcategory: | Microcontrollers - MCU |
| Tradename: | STM32 |
| Unit Weight: | 0.024037 oz |
♠ Arm®-Cortex®-M4 32b MCU+FPU, 125 DMIPS, 1MB Flash, 256KB RAM, USB OTG FS, 17 TIMs, 1 ADC, 17 comm. interfaces
STM32F412XE/G devices are based on the high-performance Arm® Cortex® -M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision dataprocessing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
STM32F412XE/G devices belong to the STM32 Dynamic Efficiency™ product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing even more power consumption saving during data batching.
STM32F412XE/G devices incorporate high-speed embedded memories (up to 1 Mbyte of Flash memory, 256 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix.
All devices offer one 12-bit ADC, a low-power RTC, twelve general-purpose 16-bit timers, two PWM timers for motor control and two general-purpose 32-bit timers.
They also feature standard and advanced communication interfaces:
• Up to four I2Cs, including one I2C supporting Fast-Mode Plus
• Five SPIs
• Five I2Ss of which two are full duplex. To achieve audio class accuracy, the I2S peripherals can be clocked via a dedicated internal audio PLL, or via an external clock to allow synchronization.
• Four USARTs
• An SDIO/MMC interface
• A USB 2.0 OTG full-speed interface
• Two CANs.
In addition, STM32F412xE/G devices embed advanced peripherals:
• A flexible static memory controller interface (FSMC)
• A Quad-SPI memory interface
• A digital filter for sigma modulator (DFSDM), two filters, up to four inputs, and support of microphone MEMs.
STM32F412xE/G devices are offered in 7 packages ranging from 48 to 144 pins. The set of available peripherals depends on the selected package.
The STM32F412xE/G operates in the -40 to +125 °C temperature range from a 1.7 (PDR OFF) to 3.6 V power supply. A comprehensive set of power-saving modes allows the design of low-power applications.
These features make the STM32F412xE/G microcontrollers suitable for a wide range of applications:
• Motor drive and application control
• Medical equipment
• Industrial applications: PLC, inverters, circuit breakers
• Printers, and scanners
• Alarm systems, video intercom, and HVAC
• Home audio appliances
• Mobile phone sensor hub
• Wearable devices
• Connected objects
• Wifi modules
• Dynamic Efficiency Line with BAM (Batch Acquisition Mode)
• Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
• Memories
– Up to 1 Mbyte of Flash memory
– 256 Kbyte of SRAM
– Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM, NOR Flash memory
– Dual mode Quad-SPI interface
• LCD parallel interface, 8080/6800 modes
• Clock, reset and supply management
– 1.7 V to 3.6 V application supply and I/Os
– POR, PDR, PVD and BOR
– 4-to-26 MHz crystal oscillator
– Internal 16 MHz factory-trimmed RC
– 32 kHz oscillator for RTC with calibration
– Internal 32 kHz RC with calibration
• Power consumption
– Run: 112 µA/MHz (peripheral off)
– Stop (Flash in Stop mode, fast wakeup time): 50 µA Typ @ 25 °C; 75 µA max
@25 °C
– Stop (Flash in Deep power down mode, slow wakeup time): down to 18 µA @
25 °C; 40 µA max @25 °C
– Standby: 2.4 µA @25 °C / 1.7 V without RTC; 12 µA @85 °C @1.7 V
– VBAT supply for RTC: 1 µA @25 °C
• 1×12-bit, 2.4 MSPS ADC: up to 16 channels
• 2x digital filters for sigma delta modulator, 4x PDM interfaces, stereo microphone support
• General-purpose DMA: 16-stream DMA
• Up to 17 timers: up to twelve 16-bit timers, two 32-bit timers up to 100 MHz each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window),
one SysTick timer
• Debug mode
– Serial wire debug (SWD) & JTAG
– Cortex®-M4 Embedded Trace Macrocell™
• Up to 114 I/O ports with interrupt capability
– Up to 109 fast I/Os up to 100 MHz
– Up to 114 five V-tolerant I/Os
• Up to 17 communication interfaces
– Up to 4x I2C interfaces (SMBus/PMBus)
– Up to 4 USARTs (2 x 12.5 Mbit/s, 2 x 6.25 Mbit/s), ISO 7816 interface, LIN,
IrDA, modem control)
– Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or I2S audio protocol), out of which 2 muxed full-duplex I2S interfaces
– SDIO interface (SD/MMC/eMMC)
– Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with PHY
– 2x CAN (2.0B Active)
• True random number generator
• CRC calculation unit
• 96-bit unique ID
• RTC: subsecond accuracy, hardware calendar
• All packages are ECOPACK®2
