TMS320F2812PGFA Digital Signal Processors and Controllers DSP DSC 32Bit Digital Sig Controller w/Flash

Short Description:

Manufacturers: Texas Instruments
Product Category: Embedded – Microcontrollers
Data Sheet: TMS320F2812PGFA
Description: IC MCU 32BIT 256KB FLASH 176LQFP
RoHS status: RoHS Compliant


Product Detail

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Product Tags

♠ Product Description

Product Attribute Attribute Value
Manufacturer: Texas Instruments
Product Category: Digital Signal Processors & Controllers - DSP, DSC
RoHS:  Details
Product: DSCs
Series: TMS320F2812
Tradename: C2000
Mounting Style: SMD/SMT
Package / Case: LQFP-176
Core: C28x
Number of Cores: 1 Core
Maximum Clock Frequency: 150 MHz
L1 Cache Instruction Memory: -
L1 Cache Data Memory: -
Program Memory Size: 256 kB
Data RAM Size: 36 kB
Operating Supply Voltage: 1.9 V
Minimum Operating Temperature: - 40 C
Maximum Operating Temperature: + 125 C
Packaging: Tray
ADC Resolution: 12 bit
Brand: Texas Instruments
Data Bus Width: 32 bit
I/O Voltage: 3.3 V
Instruction Type: Fixed Point
Moisture Sensitive: Yes
Product Type: DSP - Digital Signal Processors & Controllers
Factory Pack Quantity: 40
Subcategory: Embedded Processors & Controllers
Unit Weight: 0.066886 oz

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  • • High-performance static CMOS technology
    – 150 MHz (6.67-ns cycle time)
    – Low-power (1.8-V core at 135 MHz,1.9-V core at 150 MHz, 3.3-V I/O) design

    • JTAG boundary scan support
    – IEEE Standard 1149.1-1990 IEEE StandardTest Access Port and Boundary-Scan Architecture

    • High-performance 32-bit CPU (TMS320C28x)
    – 16 × 16 and 32 × 32 MAC operations
    – 16 × 16 dual MAC
    – Harvard bus architecture
    – Atomic operations
    – Fast interrupt response and processing
    – Unified memory programming model
    – 4M linear program/data address reach
    – Code-efficient (in C/C++ and Assembly)
    – TMS320F24x/LF240x processor source code compatible

    • On-chip memory
    – Up to 128K × 16 flash (Four 8K × 16 and six 16K × 16 sectors)
    – 1K × 16 OTP ROM
    – L0 and L1: 2 blocks of 4K × 16 each SingleAccess RAM (SARAM)
    – H0: 1 block of 8K × 16 SARAM
    – M0 and M1: 2 blocks of 1K × 16 each SARAM

    • Boot ROM (4K × 16)
    – With software boot modes
    – Standard math tables

    • External interface (F2812)
    – Over 1M × 16 total memory
    – Programmable wait states
    – Programmable read/write strobe timing
    – Three individual chip selects

    • Endianness: Little endian

    • Clock and system control
    – On-chip oscillator
    – Watchdog timer module

    • Three external interrupts

    • Peripheral Interrupt Expansion (PIE) block that supports 45 peripheral interrupts

    • Three 32-bit CPU timers

    • 128-bit security key/lock
    – Protects flash/OTP and L0/L1 SARAM
    – Prevents firmware reverse-engineering

    • Motor control peripherals
    – Two Event Managers (EVA, EVB)
    – Compatible to 240xA devices

    • Serial port peripherals
    – Serial Peripheral Interface (SPI)
    – Two Serial Communications Interfaces (SCIs), standard UART
    – Enhanced Controller Area Network (eCAN)
    – Multichannel Buffered Serial Port (McBSP)

    • 12-bit ADC, 16 channels
    – 2 × 8 channel input multiplexer
    – Two Sample-and-Hold
    – Single/simultaneous conversions
    – Fast conversion rate: 80 ns/12.5 MSPS

    • Up to 56 General-Purpose I/O (GPIO) pins

    • Advanced emulation features
    – Analysis and breakpoint functions
    – Real-time debug via hardware

    • Development tools include
    – ANSI C/C++ compiler/assembler/linker
    – Code Composer Studio™ IDE
    – DSP/BIOS™
    – JTAG scan controllers

    • IEEE Standard 1149.1-1990 IEEE Standard Test Access Port and Boundary-Scan Architecture

    • Low-power modes and power savings
    – IDLE, STANDBY, HALT modes supported
    – Disable individual peripheral clocks

    • Package options
    – 179-ball MicroStar BGA™ with external memory interface (GHH, ZHH) (F2812)
    – 176-pin Low-Profile Quad Flatpack (LQFP) with external memory interface (PGF) (F2812)
    – 128-pin LQFP without external memory interface (PBK) (F2810, F2811)

    • Temperature options
    – A: –40°C to 85°C (GHH, ZHH, PGF, PBK)
    – S: –40°C to 125°C (GHH, ZHH, PGF, PBK)
    – Q: –40°C to 125°C (PGF, PBK) (AEC-Q100 qualification for automotive
    applications)

    • Advanced Driver Assistance Systems (ADAS)

    • Building automation

    • Electronic point of sale

    • Electric Vehicle/Hybrid Electric Vehicle (EV/HEV) powertrain

    • Factory automation

    • Grid infrastructure

    • Industrial transport

    • Medical, healthcare, and fitness

    • Motor drives

    • Power delivery

    • Telecom infrastructure

    • Test and measurement

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